发明名称 THERMOSETTING RESIN COMPOSITION AND INSULATED COIL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition having hardenability in a thin film part and storage stability and an insulated coil using the composition and having high reliability and excellent producing workability with a low cost. SOLUTION: This thermosetting resin composition is composed of (A) an epoxy resin having more than two epoxy groups in a molecule, (B) a liquid cyclic acid anhydride, (C) a cationic polymerization-system hardening accelerator and (D) a metallic salt of an organic acid and/or a tetraphenyl borate salt and/or a boron trichloride complex. The thermosetting resin composition is used as a coil conductor and an insulated coil having an insulation layer obtained by dipping the composition in a layer obtained by winding an insulating tape in which an insulating material is adhered to a reinforcing material with a binder resin and hardened.
申请公布号 JP2000239356(A) 申请公布日期 2000.09.05
申请号 JP19990038048 申请日期 1999.02.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 HATANAKA YASUMICHI;HIRAMATSU SEIKI;FUJIOKA HIROFUMI;YAMAMOTO SHIGEYUKI;MURAYAMA MASAKAZU;MIYAMOTO FUMIYUKI
分类号 H01F41/12;C08G59/42;C08G59/68;H01B3/40;(IPC1-7):C08G59/42 主分类号 H01F41/12
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