METHOD AND APPARATUS FOR POSITIONING LOADING POSITION OF SEMICONDUCTOR WAFER

摘要

PURPOSE: A method and apparatus for positioning a loading position of a semiconductor wafer are to precisely transfer and load a semiconductor wafer onto a unit. CONSTITUTION: An apparatus comprises a reference plate(14), a light receiving sensor(44), an emitting sensor(42), and a positioning member for positioning the light receiving sensor on a center of a position in which the wafer is positioned. The reference plate has a hole(40a) having a constant diameter, through which a light produced from the emitting sensor is passed. The sensors detect the reference plate grasped by a robot arm(22) being positioned on a center of the arm. The light receiving sensor is detachably positioned on a center of a heating plate(14) by the positioning member. The positioning member has a bracket(46) detachably mounted a loading surface of the heating plate, and a groove(14a) for setting the bracket.