| 发明名称 |
Process for connecting circuits and adhesive film used therefor |
| 摘要 |
An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
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| 申请公布号 |
US6113728(A) |
申请公布日期 |
2000.09.05 |
| 申请号 |
US19950464118 |
申请日期 |
1995.06.05 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TSUKAGOSHI, ISAO;YAMAGUCHI, YUTAKA;NAKAJIMA, ATSUO;GOTO, YASUSHI |
| 分类号 |
H01L21/56;H01L21/58;H01L21/60;H01L23/482;H05K3/32;(IPC1-7):B32B31/00;C09J5/10 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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