| 摘要 |
PURPOSE: A labeling method of a wafer is to minimize the production of a defect by forming a wafer labeling between an edge of the wafer and a side rinse region. CONSTITUTION: A wafer is provided with a flat region(102) and a wafer edge exposed limiting region(104). An inside of the edge of the wafer is provided with a side rinse region(108). A labeling indicating a lot or wafer number is formed between the edge and the side rinse. When forming the labeling, the labeling is formed on all region except for the flat region. The labeling has a rounded shape along a curvature radius of the wafer between the edge and the side rinse region, so that a step is not formed in the side rinse region of the wafer.
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