发明名称 FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To easily and smoothly deliver a substrate between a device to achieve the processing with a surface to be processed upside and a device to form a film with the surface to be processed downside. SOLUTION: A substrate W carried in a film forming chamber 41 by a hand 26b is held and inverted by a chuck 60 driven by a chuck driving mechanism 70. A temperature regulation plate driving mechanism 80 lowers a temperature regulation member 65 to be brought into contact with a back side of the substrate W. A film is formed on a lower surface to be processed of the substrate W in a temperature-regulated condition. The substrate W on which the film is formed is inverted by turning the chuck 60 while the temperature regulation member 65 is retracted upward. The upper side of the substrate W becomes a film-formed surface.
申请公布号 JP2000239833(A) 申请公布日期 2000.09.05
申请号 JP19990049077 申请日期 1999.02.25
申请人 SUMITOMO HEAVY IND LTD 发明人 YAMAMOTO TOSHITAKA
分类号 C23C14/32;C23C14/50;H01L21/285;(IPC1-7):C23C14/32 主分类号 C23C14/32
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