| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition useful for sealing a semiconductor element loaded onto a lead frame having a palladium layer or a palladium/Au layer and capable of raising reflow resistance or moisture resistance reliability of a semiconductor device, etc., by including a specific epoxy resin, a curing agent, etc. SOLUTION: This composition is obtained by including (A) an epoxy resin containing an epoxy resin represented by formula I (n is 1-5; Gr is glycidyl) in an amount of preferably 20-100 wt.% in the component A, (B) a curing agent comprising preferably a compound represented by formula II (n is 1-5), (C) a curing accelerator comprising preferably an organophosphorus compound such as triphenylphosphine and (D) an inorganic filler such as fused silica. The equivalent ratio of the components A/B is preferably 0.8-1.3 and the amount of the component C is preferably 0.1-5.0 wt.% based on the total amount of the components A and B. The amount of the component D is preferably 75-93 wt.% based on the total amount of the composition. The compound represented by formula II is formulated in an amount of preferably 20-100 wt.% based on the total amount of the component B.
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