发明名称 |
Functionally graded metal substrates and process for making same |
摘要 |
The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/ DEG C. to about 7 ppm/ DEG C. constrains the expansion of the functional insert which has a thermal conductivity that ranges from about 200 W/mK to about 400 W/mK.
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申请公布号 |
US6114048(A) |
申请公布日期 |
2000.09.05 |
申请号 |
US19980148126 |
申请日期 |
1998.09.04 |
申请人 |
BRUSH WELLMAN, INC. |
发明人 |
JECH, DAVID E.;FRAZIER, JORDAN P.;SWORDEN, RICHARD H.;SEPULVEDA, JUAN L. |
分类号 |
B22F3/26;B22F7/00;B22F7/04;B22F7/06;C22C9/00;C22C27/04;H01L23/12;H01L23/14;H01L23/367;H01L23/373;(IPC1-7):B22F7/00 |
主分类号 |
B22F3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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