| 摘要 |
A sealing label for sealing semiconductor element comprises a metal foil substrate or a heat-resisting organic film substrate having formed thereon a sealing material component layer for sealing a semiconductor element, wherein the sealing material component layer is convexly formed such that the layer has a thick flat portion at the central portion of the substrate as compared with the peripheral portion of the substrate. The use of the sealing label in molding a semiconductor device can provide a semiconductor device having a high quality without substantially having voids in the sealing resin. |
