发明名称 PRINTED CIRCUIT BOARD WITH RADIATING MEMBER AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A printed circuit board with a radiating member and a manufacturing method thereof is to radiate heat generated from a chip and integrally form components for supplying power and radiating the heat. CONSTITUTION: A printed circuit board(10) with a radiating member comprises a radiating member which has a conductivity and is thermally and electrically connected with an outside, an insulating portion(30) for insulating the radiating member from the outside, a chip loading portion which thermally and electrically connects the radiating member with a chip and, at the same time, on which the chip is mounted, and a circuit portion for connecting the chip with the outside. In the board, the radiating member is mounted in an inside of the printed circuit board to serve as a framework, and only an upper and lower face of the chip is thermally and electrically connected to the outside.
申请公布号 KR20000055589(A) 申请公布日期 2000.09.05
申请号 KR19990004272 申请日期 1999.02.08
申请人 LG ELECTRONICS INC. 发明人 KIM, DEOK HEUNG;LIM, SEONG BAE
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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