| 摘要 |
PROBLEM TO BE SOLVED: To improve surface finished flatness after a polishing process, by polishing a medium in the presence of an electric field slurry by energizing a board, chemically and mechanically polishing a surface of the board, generating current between the board and a conductive member, and electrically polishing the board surface. SOLUTION: A rigid board 20 is polished by rotating and/or vibrating it in a state that it is pressed onto an abrasive pad 22 supported on a static abrasive platen 24. The board 20 vibrates and rotates at a place where slurry provided from a supply source 28 exists. This slurry is discharged on an interface between the abrasive pad 22 and the board 20 through one or more nozzle 30, and simultaneously a current supply voltage is impressed from a power supply 32 to a gap between the abrasive platen 24 and the board 20. The power supply 32 may be direct current(DC) voltage source, and at this case, preferably, the board 20 is a positive electrode (positive terminal) and the abrasive platen 24 is a negative electrode (negative terminal). |
