| 摘要 |
PROBLEM TO BE SOLVED: To obtain a die-attaching paste which can give e.g. an IC not undergoing poor characteristics due to chip crack or warpage by including a liquid epoxy resin with a plurality of liquid compounds having specified structures, a latent curing agent, an imidazole compound, and an inorganic filler in a specified ratio. SOLUTION: This paste comprises a normally liquid epoxy resin (A) such as a bisphenol A epoxy resin, a liquid compound (B) having a structure represented by formula I or II (wherein R is a 1C or higher alkyl), a latent curing agent (C) such as adipic dihydrazide, an imidazole compound (D) such as 2-methylimidazole, and an inorganic filler (E) selected from among a silver powder, a silica filler, etc. The paste comprises 100 pts.wt. component A, 0.05-30 pts.wt. component B, 0.5-5 wt.%, based on component A, component C, 0.5-10 wt.%, based on component A, component D, and 10-400 pts.wt., per 100 pts.wt. total of components A to D, component E. |
