| 摘要 |
PURPOSE: An apparatus for rotating a wafer is provided to prevent a slipping phenomenon between a roller bar and a wafer by forming a flattening portion on the roller bar. CONSTITUTION: A flattening portion(13a) is formed at one side of a roller bar(13). The roller bar(13) is rotated by a driving power of a motor. The driving power of the motor is transmitted to the roller bar(13) through a power transmission portion. A wafer(14) is rotated by the roller bar(13). The wafer(14) is loaded on a bath body. The flattening portion(13a) of the roller bar(13) is contacted with a flat portion(14b) of the wafer(14) when the roller bar(13) is rotated and the wafer is not rotated. The flattening portion(13a) of the roller bar(13) raises the wafer(14) and the wafer(14) is rotated continuously.
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