| 摘要 |
PURPOSE: A volatile flux composition is provided to remove oxide layer in copper and silver soldering without post treatment such as grinding and pickling. CONSTITUTION: The volatile flux composition is characterized by comprising B(CH3O)3 64-67wt.%, methyl alcohol 24-27wt.%, (CH3)2CO 9-12wt.%, silicon-based defoaming agent 2-5ppm, CH3COOLi 0.005-0.03wt.%, (CH3COO)2Cd 0.01-0.05wt.%, (C4H9)2Sn 0.02-0.10wt.%, KF(non-hydride) 0.05-0.10wt.%, anhydride HF 0.05wt.%.
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