发明名称 |
Thin-film photoelectric conversion device and sputtering- deposition method usable in manufacturing the same |
摘要 |
A sputtering-deposition method usable in forming on an insulator substrate a film including a conductive layer includes the steps of: preparing a conductive substrate holder (1) in the form of a frame having an opening (1a) at its central area and electrically grounded; positioning the insulator substrate (2) to cover the opening (1a) of the holder (1); arranging a flexible spacer (5) on a peripheral edge of the substrate (2) and also superposing a back plate (3) on the spacer (5) to press the substrate (2) against the holder (1) via the spacer (5); pressing and fixing the back plate (3) to the holder (1); and then sputtering a separately provided target to deposit a new layer on a region of the substrate (2) exposed in the holder's opening (1a). <IMAGE> |
申请公布号 |
AU1844100(A) |
申请公布日期 |
2000.08.31 |
申请号 |
AU20000018441 |
申请日期 |
2000.02.21 |
申请人 |
KANEKA CORPORATION |
发明人 |
TAKAYUKI SUZUKI;MASATAKA KONDO |
分类号 |
H01L27/142;H01L31/048;H01L31/052;H01L31/18 |
主分类号 |
H01L27/142 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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