CONDUCTIVE ELECTROLESSLY PLATED POWDER, ITS PRODUCING METHOD, AND CONDUCTIVE MATERIAL CONTAINING THE PLATED POWDER

摘要

A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 mu m and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.05 to 4 mu m on its outermost layer and the coating is substantially continuous with the small projections. A method of producing such a powder is also disclosed.