METHOD OF MANUFACTURING A LEADFRAME ASSEMBLY

摘要

The invention relates to a method of manufacturing an assembly (100) of conductors (1), wherein a void (11) is provided in an electroconductive plate (10), within which void an island (12) is formed which serves as a carrier for a semiconductor element (13) and which is connected to the assembly (100) by a part (14) of the plate (10). Within the void (11), a number of strip-shaped conductors (1) are formed which surround the island (12), and the void (11) is formed so that one (1n) of the strip-shaped conductors (1) is connected to the island (12) by means of a further part (15) of the plate (10). According to the invention, the void (11) is formed so that two or more strip-shaped conductors (1) are electroconductively connected to the island (12) by means of a further part (15) of the plate (10), and at least one of the further parts (15) of the plate (10) is removed by means of punching.