| 摘要 |
<p>A resin composition which comprises (A) 100 parts by weight of a thermoplastic resin, (B) 1 to 30 parts by weight of a carbon fiber having a diameter of 1 nm to 1 νm, a length of 1 νm to 3 mm and a volume resistivity of 1 Φ cm or less, and (C) 5 to 200 parts by weight of an antistatic polymer having a surface resistivity of 10?8 to 1011¿ Φ as measured under a voltage of 500 V and a melting point of 100 °C or higher, and also having an apparent melting viscosity of 10 to 1000 Pa.s under a condition of an apparent shear rate of 1000 sec-1 and 260 °C and a ratio of the apparent melting viscosity thereof to that of the thermoplastic resin under the above conditions of 0.01 to 1.3; and a jig for use in transportation in electronics fields comprising the same. The resin composition provides a resin composition which is excellent in antistatic and static electricity-dissipating properties and is markedly improved with respect to the uniformity of antistatic properties (saturated electrostatic voltage and half-life of electrostatic voltage) in a surface of a formed article prepared therefrom.</p> |
