Negative-type light-sensitive resin composition for manufacture of circuit boards, semiconductor chip carriers and semiconductor devices, contains cis-diene substituted polyamic acid or polyimide and oxygen sensitizer

摘要

A light-sensitive resin composition includes an oxygen sensitizer together with a cis-diene-substituted polyamic acid or polyimide containing specified structural units. The composition includes an oxygen sensitizer together with a cis-diene-substituted polyamic acid or polyimide containing structural units from those of formulae (I)-(V); [Image] [Image] [Image] [Image] at least one of R 1> - R 20>, R 22>-R 25> and R 26>-R 33>a monovalent organic group with a cis-diene structure, while any other(s) = H, OH, carboxyl or 1-20C alkyl or alkoxy; R 21>, X 1>, X 2> and Y 1>O, S or 1-4C alkylene, alkylidene or alkyleneoxy, with these values for X 1>, X 2> and Y 1> optionally being substituted; Ar 1> and Ar 2>a divalent aromatic group; and l 1, l 2, m 1, m 2 and n 10 or 1, with the proviso that m 1 =1 when l 1 =1 and m 2 = 1 when m 2 = 0. Independent claims are also included for the production of circuit boards, carriers for semiconductor chips and semiconductor devices.