| 发明名称 |
REACTIVE HOT MELT ADHESIVE |
| 摘要 |
<p>The present invention relates to solvent free, moisture-curable, reactive hot melt adhesive compositions that are solid at room temperature, method of making the compositions, and laminates prepared using the compositions. The compositions are a mixture comprising an isocyanate terminated prepolymer and a thermoplastic vinyl chloride copolymer.</p> |
| 申请公布号 |
WO0050236(A1) |
申请公布日期 |
2000.08.31 |
| 申请号 |
WO2000US03613 |
申请日期 |
2000.02.11 |
| 申请人 |
ASHLAND INC. |
发明人 |
CHANG, CHUNG-YING;WALSWORTH, GARY, J. |
| 分类号 |
B32B7/12;B32B27/40;C08G18/12;C08G18/40;C08L75/04;C09J127/06;C09J175/04;(IPC1-7):B32B27/30;C08L27/06 |
主分类号 |
B32B7/12 |
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