发明名称 Method of securely mounting conductive balls
摘要 A suction head sucks up conductive balls to its suction holes, and mounts them on pads of said workpiece. That is, the suction head is lowered so as to land the conductive balls onto the pads, and then is raised, and a positive pressure is applied in a space defined in the suction head and communicated with the suction holes and thereafter, the positive pressure is released so as to effect the atmospheric pressure in the space. As a result, the conductive balls are smoothly and surely separated from the suction holes and mounted onto the pads of the workpiece. Thereby it is possible to rapidly mount the conductive balls sucked at the lower surface of the suction head onto the pads of the workpiece.
申请公布号 US6109509(A) 申请公布日期 2000.08.29
申请号 US19970887337 申请日期 1997.07.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SAKAI, TADAHIKO;SAKEMI, SHOJI
分类号 B23P19/00;B23K3/06;B23P19/04;B23P21/00;B25J15/06;B65G47/91;H01L21/48;H01L21/60;H05K3/34;(IPC1-7):B23K1/018;B23K1/00;B23K31/02 主分类号 B23P19/00
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