| 摘要 |
PROBLEM TO BE SOLVED: To assure an electric-mechanical connection between a bump electrode and pad electrode, even if an adhesive material supplied on a wiring board in advance is spread under pressure by a semiconductor pellet and the area between the bump electrode and pad electrode is filled with it before they contact with each other, in particular, the adhesive material has insulating particulate filler electrically diffused with the bump electrode leveled. SOLUTION: A semiconductor pallet 1 where multiple bump electrodes 3 are formed on one surface and a wiring board 4 where a pad electrode 8 is so formed as to at least correspond to the bump electrode 3 of the semiconductor pellet 1 on an insulating substrate 5, are made to face each other via a resin adhesive material 9, and electrodes 3 and 8 are polymerized and applied with a pressure for electrical connection each other, while the facing surfaces of the semiconductor pellet 1 and wiring board 4 are bonded. Here, the bump electrode 3 which formed of a soft metal which deforms under pressure comprises a surface facing the pad electrode 8 and a fine rough part 10 which opens to the periphery adjacent to the surface, abuts on the pad electrode 8 so that the protruding part of the fine unevenness part 10 is crushed and are connected. |
