摘要 |
PROBLEM TO BE SOLVED: To prevent inter-wiring short circuit caused by microscratch. SOLUTION: An insulating film 4 is polished in a mechanochemical polishing method, and a conductive film is formed on the insulating film 4, and then patterned to form a conductive layer 9. Then the conductive layer 9 is covered with skin materials 8 and 12, and a conductive film remaining in a scratch 6 formed on the insulation film 4 caused by the mechanochemical polishing method is removed. It is desirable that the conductive layer 9 be an electrode of a stack type capacitor. |