| 摘要 |
PROBLEM TO BE SOLVED: To efficiently radiate heat generated by a light emission diode and exactly position the light emission diode on a base substrate. SOLUTION: A mounting hole 4 is formed in a printed circuit board comprising a conductive pattern 3 formed on a metallic base substrate 1 via an electrical insulating layer 2. A part of a light emission diode 6 is inserted into the hole 4. One electrode of the diode 6 is connected to the substrate 1 by solder 8 filled in the hole 4, and the other electrode of that is connected to the pattern 3 by use of a bonding wire 7. |
