| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition which yields a cured product having an excellent heat resistance and solvent resistance and is suitable for adhesives, adhesive tapes, etc. SOLUTION: This curable composition comprises (A) an alkenyl phenol compound, (B) a maleimide compound and (C) a linear or branched silicone having one or more hydrolyzable silyl groups within a molecule. Here, the ratio (wt.%) of component (A) to component (B) is (A):(B)=(20-80):(80-20), and the percentage of component (C), based on the total weight of components (A), (B) and (C), is 10 to 70 wt.%.
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