| 摘要 |
PROBLEM TO BE SOLVED: To obtain a paste composition which improves the reflow resistance when used as a die bonding material for a semiconductor device using a support member chiefly made from an organic material by compounding a (meth)acrylic ester compound with a specified-functional-group-containing butadiene (co)polymer, a radical initiator, and a filler. SOLUTION: The functional groups of the specified-functional-group-containing butadiene (co)polymer (B) are at least one type of groups selected from epoxy groups, carboxyl groups, acid anhydride groups, and radically polymerizable groups. It is desirable that a homopolymer of the (meth)acrylic ester compound (A) has a glass transition temperature of 100 deg.C or below, and component B has a glass transition temperature of 20 deg.C or below and is contained in an amount of 50-400 pts.wt. per 100 pts.wt. component A. It is desirable that component B has a number-average molecular weight of 800-5,000 and 1-6 functional groups in the molecule. The filler used is desirably platy aluminum oxide.
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