SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To fabricate a semiconductor device without decreasing the yield, even when other semiconductor chips having an exterior dimension smaller than a normal semiconductor chip are to be included. SOLUTION: This semiconductor device has a substrate 1 whose plane surface is formed into a square shape and on which wiring 2 is formed on its surface (chip mounted surface) of the both sides, a semiconductor chip 7A which is mounted on the surface of the substrate 1 and on the surface of which an electrode is formed (circuit formed surface) of the both sides and a conductive wire 10 for electrically connecting the electrode on the semiconductor device chip 7A and the wiring 2 on the substrate 1. The wiring 2 has a plurality of pads 3 for connecting wires arrayed towards the inside from the peripheral side of the substrate 1.