| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce frequency of alignment and improve efficiency of operation by carrying out alignment to a mark in one fixed position among marks within the range of a shot and obtaining a position of all the chips based on alignment information. SOLUTION: If attention is paid to chips A to H, for example, chips A to D are exposed on a first shot. After a stage whereon a wafer is loaded is subjected to step movement, chips E to H are exposed by a second shot. In the process, if a position of chips B, C, D to a position of a chip A in one shot is decided first, a position of chips F, G, H can be known just by carrying out alignment to a chip E, for example, in the next one shot. A position of each chip is obtained indirectly by carrying out alignment to an alignment mark inside the same shot.</p> |
