| 发明名称 |
Method of forming solder bumps and method of forming preformed solder bumps |
| 摘要 |
A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.
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| 申请公布号 |
US6109507(A) |
申请公布日期 |
2000.08.29 |
| 申请号 |
US19980079521 |
申请日期 |
1998.05.15 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
YAGI, HARUMI;OZAKI, NORITSUGU;YAMAMOTO, TSUYOSHI;NAKADA, TOSHIYUKI;KOMIYAMA, TAKESHI;OKUWAKI, YOSHIHITO |
| 分类号 |
H01L23/12;H01L21/60;H05K3/12;H05K3/34;(IPC1-7):B23K31/02;H05K3/32 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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