发明名称 |
Method of making a circuitized substrate |
摘要 |
A method of making a circuitized substrate wherein a chip-accommodating cavity is formed along with a plurality of conductive elements (e.g., pads, lines, etc.) which form part of the substrate's circuitry. Metallization is facilitated by the use of a photoimageable member that allows for initial removal (peeling) of its sacrificial layer, followed by eventual removal of the photoimaging layer which also forms part of this member. Exposure of the photoimaging layer may occur either through the protective sacrificial layer or subsequent removal thereof.
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申请公布号 |
US6110650(A) |
申请公布日期 |
2000.08.29 |
申请号 |
US19980042898 |
申请日期 |
1998.03.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BHATT, ANILKUMAR CHINUPRASAD;MILLER, THOMAS RICHARD;MORING, ALLEN FREDERICK;WALSH, JAMES PAUL |
分类号 |
H01L21/48;H01L23/13;H01L23/498;H05K1/02;H05K1/18;H05K3/06;H05K3/10;H05K3/40;H05K3/42;(IPC1-7):G03F7/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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