| 摘要 |
A method for etching substrates, comprising providing at least a first and a second substrate having a coating selected from the group consisting of semiconductor coatings, metallic coatings, and mixtures thereof and introducing at least the first substrate and an etchant into a first tank to etch at least a portion of the coating from the first substrate, introducing at least the second substrate into a second tank and transferring the etchant from the first tank to the second tank to provide etch of at least a portion of the coatings from the second substrate, and removing the etched first substrate from the first tank. |
