| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniature high-sensitivity semiconductor pressure sensor. SOLUTION: This semiconductor acceleration sensor comprises a weight 12, a thin flexible portion 11 formed on a main surface side of a first substrate 10 so as to be integrally connected to the weight 12 at one end, a supporting portion 13 integrally connected to the other end of the flexible portion 11 so as to rockably support the weight 12 therethrough, and a semiconductor chip 1 integrally formed by etching the first substrate 10. A top cap 30 made of glass is connected to a main surface side of the semiconductor chip 1 by a positive electrode. A sensor chip A includes a second substrate 20 connected to the reverse side of the first substrate 10, and an added weight 24 formed by separation from the second substrate 20 so as to be connected to the weight 12. The second substrate 20 is provided with a stopper 26 for regulating a movement range of the added weight 24 in a direction from the main surface of the first substrate 10 to the reverse thereof. |
