| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a pressure sensor as a whole without miniaturizing a semiconductor pressure sensor chip. SOLUTION: This pressure sensor 11 is constituted by integrating a mounting part 12 and a pressure introduction tube part 13. A U-shaped housing part 16 is formed in the pressure introduction tube part 13. A semiconductor pressure sensor chip 17 which is bonded to a support pedestal 18 is arranged and installed at the housing part 16. A gas or a liquid whose pressure is to be detected is guided, through a pressure introduction passage 19, to the rear surface of the semiconductor pressure sensor chip 17. The semiconductor pressure sensor chip 17 outputs a detection pressure, At this time the semiconductor pressure sensor chip 17 is arranged and installed inside the pressure introduction tube part 13 in such a way that its face direction is along a direction at right angles to the face direction of the mounting part 12. As a result, as compared with a constitution in which the semiconductor pressure sensor chip 17 is arranged and installed in the face direction of the mounting part 12, the mounting part 12 and the pressure sensor 11 can be miniaturized.
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