| 摘要 |
PROBLEM TO BE SOLVED: To stabilize a lead frame for a temperature suitable for bonding and to shorten the time required for reaching the optimum temperature by preventing an excessive oxidation with the lead frame. SOLUTION: This equipment is provided with an electrode of a semiconductor chip 2 and a lead frame 1 are connected with a bonding wire 3. Here, a hot air gun 6 which jets a heated nitrogen gas toward the lead frame 1, a nitrogen gas valve 8 for adjusting the flow rate of the nitrogen gas towards the hot air gun 6, a noncontact type temperature sensor 5 for detecting the temperature of the lead frame 1, and a temperature controller 7 which adjust the temperature of a gas jetted from the hot air gun 6 so that the lead frame 1 approaches the temperature suitable for bonding based on the temperature detected by the temperature sensor 5 while adjusts the flow rate of the nitrogen gas valve. |
