| 摘要 |
PROBLEM TO BE SOLVED: To resist inner stress due to thermal expansion and mechanical stress from an outside during operation by providing a semiconductor region, a semiconductor chip with an electrode provided to a surface thereof, a lead electrode connected to an electrode by a junction material and a member positioned between a surface of a semiconductor region and a lead electrode. SOLUTION: An insular glass 50 which does not adhere to solder is formed in a central part of an anode electrode 20 which is one main surface. In solder adhesion between the anode electrode 20 and an anode side lead electrode 22, the protruded thickness of the lead electrode 22 and the thickness of the glass 50 are ensured between the electrode 20 and the lead electrode 22. Furthermore, since the lead electrode 22 is apart from the anode electrode 20 by about the thickness of the glass 50, there should be no part wherein the anode electrode 20 and the lead electrode 22 are in direct contact with each other. Since a part wherein the semiconductor chip 100 and an anode side lead electrode 22 are in contact with each other always has solder inbetween while ensuring a fixed solder thickness, various stresses are absorbed by soft solder and damage to the semiconductor chip 100 can be relaxed. |
