| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wireless MMIC chip packaging mechanism which can maintain an MMIC chip upside up with its upper surface faced upward. SOLUTION: An MMIC chip 38 is positioned within a cavity 40 of a fixing tool 42, and a backside metal layer 44 of the chip 38 is mounted to the fixing tool 42 through a conductive epoxy layer. RF and DC via feed-through holes 62 and 64 effectively pass through the chip 38 and electrically connected to a separation island 70 of the rear-side metal layer 44. Substrates 52 and 56 are extended under a microstrip 54, an electric trace 58 and the chip 38 to electrically connect ends of the microstrip 54 and trace 58 to the separation island 70. In another design, a single substrate is extended on the backside of the chip 38 so as to completely cross the backside, and a ground via is extended to pass through the single substrate to connect the backside metal layer 44 to the fixing tool 42.</p> |
