SEMICONDUCTOR WAFER, AND MANUFACTURE THEREOF, AND USE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To make the line width of an electronic element small, by specifying the local maximum flatness, and so arranging the flatness of the edge region as not to be remarkably different from the flatness of the center region. SOLUTION: The front and rear of a semiconductor wafer are polished at the same time between rotating polishing surface plates while being supplied with polishing sol. The scale of flatness SFQR shows the region of positive and negative deviation of the front being defined about the minimum square error, to the element face of determined dimension. The semiconductor wafer is equipped with a front plane and a rear plane, and besides it is polished so that the flatness relevant to the partial region of a plane luster at the front of the semiconductor wafer may be a maximum local flatness SFQRmax equal to 0.13μm or smaller than it, and that in the edge region of the semiconductor wafer, it may be an SFQR individual value not remarkably different from the SFQR individual value in the center region of the semiconductor wafer. The final product becomes a wafer which is suitable as the departure material to the semiconductor element process having a small line width.