发明名称 |
Interconnection with integrated corrosion stop |
摘要 |
An interconnection structure for a semiconductor circuit is provided employing a conductor structure electrically connected to conductive wiring located on a different level than the conductor structure. The conductor structure comprises a relatively low resistivity metal. A barrier layer of a corrosion resistant metal is located intermediate the relatively low resistivity metal and wiring to thereby separate the wiring and relatively low resistivity metal.
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申请公布号 |
US6111301(A) |
申请公布日期 |
2000.08.29 |
申请号 |
US19980066121 |
申请日期 |
1998.04.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
STAMPER, ANTHONY K. |
分类号 |
H01L23/00;H01L23/525;(IPC1-7):H01L29/00;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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