发明名称 SOLDERING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a soldering equipment which is improved in floor efficiency, without increasing the equipment in installation area and can be lessened in man-hours and cost, even when a layout is changed. SOLUTION: A soldering equipment is equipped with a board set, composed of a board set inlet 2a and a board set outlet 2b, a flux application part 3, a preheating part 4, a soldering part 5, a cooling part 6, a cutter part 7, and a burr removing part 8 which are continuously arranged inside a case 1 along its sides. The board set inlet 2a, the flux application part 3, the prep-heating part 4, the soldering part 5, the cooling part 6, the cutter part 7, the burr removing part 8, and the board set outlet 2a are arranged in this sequence inside the case 1, and a mechanism which turns a carrier 9 to the right by an angle of 90 deg. is provided in each of the board set outlet 2a, the pre-heating part 4, the cooling part 6, and the board set outlet 2b respectively.
申请公布号 JP2000236164(A) 申请公布日期 2000.08.29
申请号 JP19990037983 申请日期 1999.02.17
申请人 NEC MIYAGI LTD 发明人 SUGANO MASARU
分类号 H05K3/34;B23K3/00;(IPC1-7):H05K3/34 主分类号 H05K3/34
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