发明名称 Method of purifying alkaline solution and method of etching semiconductor wafers
摘要 A method of purifying an alkaline solution includes dissolving metallic silicon and/or silicon compounds in the alkaline solution and non-ionizing metallic ions in the alkaline solution with reaction products generated when the metallic silicon and/or silicon compounds are dissolved therein. This purifying method is capable of remarkably decreasing metallic ions in the alkaline solution at a low-cost by an easy operation. A method of etching semiconductor wafers includes purifying an alkaline solution by non-ionizing metallic ions in the alkaline solution and etching the semiconductor wafers by using the purified alkaline solution. According to this etching method, the metallic contamination level due to the etching of the semiconductor wafers is greatly decreased, there being neither deterioration in the wafer quality nor deterioration in the characteristic of the semiconductor device.
申请公布号 US6110839(A) 申请公布日期 2000.08.29
申请号 US19960703645 申请日期 1996.08.27
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 NAKANO, MASAMI;UCHIYAMA, ISAO;AJITO, TOSHIO;KUDO, HIDEO
分类号 C01D1/28;C30B29/06;C30B33/10;H01L21/308;(IPC1-7):B44C1/22 主分类号 C01D1/28
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