| 摘要 |
PROBLEM TO BE SOLVED: To reduce stresses applied to a semiconductor chip and a connection member in the connection of the semiconductor chip and wiring board typified by flip-chip mounting. SOLUTION: A semiconductor chip 1 and a wiring board 2 for mounting it are bonded by a melted solder bump 3. The thickness ratio of the semiconductor chip 1 and the wiring board 2 is determined, based on the modulus of elasticity of the semiconductor chip 1 and that of wiring board 2 so that the maximum deflection of the semiconductor chip 1 and that of the wiring board 2 are made the same value. Consequently, the stress applied to the semiconductor chip 1 and solder bump 3 by thermal stress or an external force is reduced and optimized at the same time. Also, the reliability of a semiconductor device can be improved. |
