| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board, where a bonding operation or an operation of bonding a semiconductor chip to the board provided with a conductive layer and a through-hole can be easily and surely carried out and a high bonding strength can be attained, when a semiconductor chip is fixed to the wiring board, the conductive layer of the board is connected to the electrode of the semiconductor chip with a bonding wire, or the semiconductor chip is fixed directly to the conductive layer of the wiring board. SOLUTION: A wiring board A has a structure, where a conductive layer 2 is formed on an insulating layer 1, a projection 3 which protrudes from a solder resist layer 4 and is substantially rectangular or step-formed in cross section is formed by plating on the conductive layer 2, through-holes 5 and 5 are bored in the insulating layer 1, a semiconductor chip 7 is fixed on the solder resist layer 4, and the top of the projection 3 is connected to the electrodes of the semiconductor chip 7 with bonding wires 8 and 8.</p> |
