GROOVING DEVICE OF WORKPIECE BY WIRE SAW

摘要

PROBLEM TO BE SOLVED: To provide a grooving device of a workpiece by a wire saw capable of grooving grooves having uniform depth with high precision in a short time without causing a crack in the workpiece by curving a surface of the workpiece like a thin plate made of a hard and fragile material such as a semiconductor wafer. SOLUTION: This grooving device of a workpiece by a wire saw forming a groove on a surface of the workpiece by applying the workpiece against a running wire is provided with a workpiece fixing mechanism 10 fixing the workpiece 1 by curving it in such a way that its central part protrudes on a side of the wire 2 from the surroundings and a workpiece pushing out mechanism (lifting mechanism 30, etc.), applying the curved and fixed workpiece 1 against the wire 2 to groove a groove on the surface of the workpiece 1. The workpiece fixing mechanism 10 is provided with a mechanism which forms the curved surface of the workpiece 1 into a curved face having curvature central axis crossing running direction of the wire 2 orthogonally and a function setting an arbitrary curve amount of the workpiece.