| 摘要 |
PROBLEM TO BE SOLVED: To shorten a substrate treating time including etching treatment, and to collect etching liquid, and to surely remove a thin film formed on the back face of the substrate or the edge part of the substrate. SOLUTION: While a spin base 2 is rotated by a motor 10 in a state in which a wafer W on whose surface a thin film is formed is held by a holding member 3, an etchant is supplied from a treatment liquid ejecting part 6 to the back face of the wafer W held by the holding member 3. When an atmospheric shielding member 20 having a face opposite to the surface of the waver W, which is separated from the surface of the wafer W by a prescribed interval, is rotated by a motor 12, the etching liquid is supplied only to the back face of the wafer W and the surface edge part of the wafer W by the rotation of the wafer W and the rotation of the atmospheric shielding member 20, and a thin film due to photoresist or the like is removed only on the back face of the wafer W and the surface edge part of the wafer W.
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