| 摘要 |
Curable suspensions of an epoxy resin formulation comprising a) a storage-stable suspension of an epoxy resin and a toughener suspended therein which contains no groups that react with a curable epoxy resin system, b) dicyandiamide, a polycarboxylic acid, a polycarboxylic anhydride, a polyamine, a polyaminoamide, an amino group-containing adduct of an amine and a polyepoxide, a polyol or a catalytically curing hardener, and, as optional components, c) a curing catalyst, conventional fillers or reinforcing materials, are particularly suitable for use as casting resins, laminating resins or adhesives.
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