| 摘要 |
PROBLEM TO BE SOLVED: To provide an additive adhesive resin compsn. which enables the formation of via holes with good accuracy by photoimaging by developing with an alkali aq. soln., which has excellent resistance against a plating liquid for electroless plating, excellent adhesive strength with plating copper, heat resistance even at a temp. around 260 deg.C in a soldering process, and flame- retardant property. SOLUTION: This compsn. contains the following components (1), (2), (3), (4), (5) and (6) as the essential components. They are (1) a polyfunctional epoxy resin having 120 to 500 epoxy equiv., (2) a brominated polyfunctional epoxy resin having 120 to 500 epoxy equiv., (3) a modified phenol novolak in which 20 to 60% of phenolic hydroxy groups are reacted with glycidyl acrylate or glycidyl methacrylate, (4) a diluent comprising polyfunctional photopolymerizable monomers, (5) a photopolymn. initiator and (6) an inorg. filler having 1 to 6 μm average particle size. |
