| 摘要 |
PROBLEM TO BE SOLVED: To prevent alloying due to thermal diffusion between an underlying gold wiring and a tin layer of an outermost surface by making a first metallic layer which mainly becomes an underlying substrate, a second metallic layer which mainly becomes a wiring layer, a third metallic layer which becomes a diffusion prevention layer of tin, and a forth metallic layer comprising tin constituent factors. SOLUTION: A first metallic layer 2 is inserted mainly to raise adhesion strength between a wiring layer 5 and a substrate 1 and is constituted of a single layer or a plurality of layers consisting of a metal species such as Ti, Pd, Cu. The second metallic layer 5 is inserted mainly to be used as a wiring layer and a gold-basis metal species which is low in conduction resistance and excellent in acid resistance is used. A third metallic layer 9 is inserted mainly to prevent gold in the wiring layer 5 and tin of an outermost surface from alloying due to thermal diffusion and is constituted of a single layer or a plurality of layers comprising a metal species such as Ti, Pd, Cr. A fourth metallic layer 10 is used to carry out connection by alloying with a gold bump at a conductor integrated circuit side and a metal species comprising tin is used.
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