| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device comprising tape BGA(TBGA) package structure of high productivity and reliability by preventing a void taking place at an adhesive interface, when it bonded to an IC chip to significantly lower reliability, due to dispersion in the shape of an IC chip mounting adhesive part of a metal plane. SOLUTION: The shape of an IC chip mounting adhesive part 9 of a metal plate 8 is allowed to be an appropriate protruding state, so that the occurrence of voids which tend to take place at bonding of an IC chip is prevented for realizing high reliability. Here, with the diagonal length of an IC chip size of L while the maximum deflected amount of metal plate towards an IC chip adhesive surface side is (h), the relation between them is represented by the ratio h/L. Here an appropriate protruding state is set when h/L=0.001-0.006.
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