发明名称 |
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same |
摘要 |
A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.
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申请公布号 |
US6111306(A) |
申请公布日期 |
2000.08.29 |
申请号 |
US19970944511 |
申请日期 |
1997.10.06 |
申请人 |
FUJITSU LIMITED;KYUSHU FUJITSU ELECTRONICS LIMITED |
发明人 |
KAWAHARA, TOSHIMI;NAKASEKO, SINYA;OSAWA, MITSUNADA;OSUMI, MAYUMI;ISHIGURO, HIROYUKI;KATOH, YOSHITUGU;KASAI, JUNICHI;TANIGUCHI, SHINICHIROU;SAKURAI, YUJI |
分类号 |
H01L21/48;H01L21/56;H01L21/68;H01L23/24;H01L23/31;H01L23/498;(IPC1-7):H01L23/02;H01L23/15 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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