发明名称 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
摘要 A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.
申请公布号 US6111306(A) 申请公布日期 2000.08.29
申请号 US19970944511 申请日期 1997.10.06
申请人 FUJITSU LIMITED;KYUSHU FUJITSU ELECTRONICS LIMITED 发明人 KAWAHARA, TOSHIMI;NAKASEKO, SINYA;OSAWA, MITSUNADA;OSUMI, MAYUMI;ISHIGURO, HIROYUKI;KATOH, YOSHITUGU;KASAI, JUNICHI;TANIGUCHI, SHINICHIROU;SAKURAI, YUJI
分类号 H01L21/48;H01L21/56;H01L21/68;H01L23/24;H01L23/31;H01L23/498;(IPC1-7):H01L23/02;H01L23/15 主分类号 H01L21/48
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