Apparatus and process for the slicing of monocrystalline silicon ingots

摘要

Apparatus and methods for use in slicing a monocrystalline silicon ingot by means of a web of wire saws, in which load sensing means is employed to measure forces applied to the ingot by the interaction of the wire saws with the ingot. The measured forces are used to control the speed of travel of a table on which the ingot is mounted relative to the wire saws, such that forces applied to the wire saws do not exceed a predetermined proportion of the breaking strain of the wires. The apparatus and methods may be employed to facilitate the determination of a suitable table speed profile and/or may provide active control of the table speed during the progress of cutting operations.