| 摘要 |
Each auxiliary section (5, 6) of the mould tool half sections (1, 2) includes a product-dependent mould section (7, 8) comprising an injection-mouldable material forming the mould cavity (9). An apparatus for encapsulating electronic components, especially integrated circuits (ICs) (14), comprises at least one mould tool with two half sections defining one or more mould cavities. Each half section comprises a main section (3, 4) and at least one half section contains an auxiliary section capable of defining at least part of the mould cavity. A compression region (11) in one half section is used to force encapsulating material (13) into the mould cavity. Means are provided for supplying a protective film (16) for covering at least part of the half section surface area. Each auxiliary section includes a product-dependent mould section comprising a mould cavity material, which can be formed by injection-moulded. Independent claims are also included for (a) the mould tool, (b) the mould tool half sections, and (b) the auxiliary sections of the tool half sections. |
